Radiation-curable resin composition and cured product thereof

A radiation-curable resin composition comprising an inorganic component containing a silica particle composed of a hydrolyzate of an oligomer of an alkoxysilane and a monomer and/or an oligomer thereof, wherein viscosity at 25° C. is from 1,000 to 10,000 centipoises.

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Bibliographische Detailangaben
Hauptverfasser: Esaki, Akira, Matsuda, Osamu
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A radiation-curable resin composition comprising an inorganic component containing a silica particle composed of a hydrolyzate of an oligomer of an alkoxysilane and a monomer and/or an oligomer thereof, wherein viscosity at 25° C. is from 1,000 to 10,000 centipoises.