Bezel design for surface mount display modules

Improved electronic display module for surface mount construction. Plastic components are heat-stake mounted to a printed circuit board substrate. Providing recesses for the reflowed plastic heat stakes reduces or eliminates rework required to provide flat surface needed for surface mounting.

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Bibliographische Detailangaben
Hauptverfasser: Goh, Seng Geap, Hwang, Yi Feng, Cheng, Heng Yow
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Improved electronic display module for surface mount construction. Plastic components are heat-stake mounted to a printed circuit board substrate. Providing recesses for the reflowed plastic heat stakes reduces or eliminates rework required to provide flat surface needed for surface mounting.