Method for producing an optical splitter, and optical splitter

An optical splitter has an optical chip, in which a conductor track is arranged on a carrier substrate, wherein a conductor track section of the conductor track running from a first side of the chip branches into different conductor track sections which run to a second side of the chip via a plurality of branching nodes. An optical waveguide section of an optical waveguide is bonded at the first side of the chip by means of an adhesive material. Correspondingly, optical waveguide sections are bonded on the second side of the chip by means of an adhesive material. In order to reinforce the fixing, glass plates are arranged over and under the optical waveguides, said glass plates being bonded to the optical chip at the respective lateral surfaces.