Interlayer dielectric and pre-applied die attach adhesive materials

The present invention relates to interlayer dielectric materials and pre-applied die attach adhesives, more specifically pre-applied die attach adhesives (such as wafer and other substrate-applied die attach adhesives), methods of applying the interlayer dielectric materials onto substrates to prepa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Santos, Benedicto delos, Huneke, James T, Liu, Puwei, Yang, Kang, Ji, Qing
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present invention relates to interlayer dielectric materials and pre-applied die attach adhesives, more specifically pre-applied die attach adhesives (such as wafer and other substrate-applied die attach adhesives), methods of applying the interlayer dielectric materials onto substrates to prepare low K dielectric semiconductor chips, methods of applying the pre-applied die attach adhesives onto wafer and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.