UV assisted thermal processing

The present invention provides methods and apparatus for performing thermal processes to a semiconductor substrate. Thermal processing chambers of the present invention comprise two different energy sources, such as an infrared radiation source and a UV radiation source. The UV radiation source and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Ranish, Joseph Michael, Yokota, Yoshitaka
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present invention provides methods and apparatus for performing thermal processes to a semiconductor substrate. Thermal processing chambers of the present invention comprise two different energy sources, such as an infrared radiation source and a UV radiation source. The UV radiation source and the infrared radiation source may be used alone or in combination to supply heat, activate electronic, or create active species inside the thermal processing chamber.