Method for connection of an integrated circuit to a substrate, and a corresponding circuit arrangement

abThe present invention provides a method for connection of an integrated circuit, in particular of a chip, a wafer or a hybrid, to a substrate, which has the following steps: provision of an elastic intermediate layer on the integrated circuit and/or the substrate; structuring of the elastic layer in raised areas and recessed areas; and connection of the substrate and of the integrated circuit via the structured elastic intermediate layer. The invention likewise provides a corresponding circuit arrangement.