Adjusting die placement on a semiconductor wafer to increase yield
A die placement of dice to be formed on a semiconductor wafer is adjusted by obtaining a die placement and one or more locations on the wafer contacted by one or more processing structures or a substance emitted by one or more processing structures. The die placement is adjusted based on the obtaine...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A die placement of dice to be formed on a semiconductor wafer is adjusted by obtaining a die placement and one or more locations on the wafer contacted by one or more processing structures or a substance emitted by one or more processing structures. The die placement is adjusted based on the obtained one or more locations on the wafer. |
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