Interconnect structure and process of making the same

A method of forming an interconnect structure in an inter-layer dielectric (ILD) material, the method include the steps of creating one or more via openings in the ILD material; forming a first liner covering at least one of the one or more via openings; creating one or more trench openings on top o...

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Bibliographische Detailangaben

Hauptverfasser:	Standaert, Theodorus Eduardus, Davis, Pegeen M, Fitzsimmons, John Anthony, Greco, Stephen Edward, Ko, Tze-Man, Lustig, Naftali Eliahu, Nicholson, Lee Matthew, Sankaran, Sujatha
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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