Transmission line to waveguide interconnect and method of forming same including a heat spreader

An MMIC chip is disclosed that includes a planar substrate having a first surface and a second surface, a conductive layer having an opening on the first surface, a transmission line on the second surface, at least one conductor extending from the conductive layer to the second surface defining a wa...

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Bibliographische Detailangaben
1. Verfasser: Stenger, Peter A
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An MMIC chip is disclosed that includes a planar substrate having a first surface and a second surface, a conductive layer having an opening on the first surface, a transmission line on the second surface, at least one conductor extending from the conductive layer to the second surface defining a waveguide around the opening, wherein the transmission line is connected to the at least one conductor such that a signal traveling along the transmission line is guided toward the opening in the first side by the at least one conductor.