Method of fabricating a multilayered dielectric diffusion barrier layer
A method of fabricating a structure including a low-k multilayered dielectric diffusion barrier layer having at least one low-k sublayer and at least one air barrier sublayer is described herein. The method includes applying a coating of a polymeric preceramic precursor, converting the polymeric pre...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A method of fabricating a structure including a low-k multilayered dielectric diffusion barrier layer having at least one low-k sublayer and at least one air barrier sublayer is described herein. The method includes applying a coating of a polymeric preceramic precursor, converting the polymeric preceramic precursor into a low-k sublayer, applying a coating of an air barrier sublayer and exposing the air barrier sublayer to a reactive plasma. |
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