Apparatus and method for flipping electronic components

An apparatus and method is provided for flipping electronic components in the sense of changing their orientation, such as for changing the orientation of electronic components between 'live bug' and 'dead bug' orientations. The apparatus comprises a rotary device that is configured to receive the electronic component and a force actuator operative to bias the electronic component into engagement with the rotary device. A driving mechanism coupled to the rotary device is operative to rotate said rotary device for changing the orientation of the electronic component, after which an ejector is used to eject the electronic component from the rotary device after changing the orientation of the electronic component.