Chip receptacle, method for fabricating a chip receptacle and chip transport container

Cavities for holding semiconductor chips are etched anisotropically into a semiconductor wafer. An orientation of the wafer in the (100) pulling direction results in geometrically exactly etched sidewalls of the cavities with an angle of 125.3°. What is thereby achieved is that chips can slip into t...

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Bibliographische Detailangaben
Hauptverfasser: Kaempf, Mathias, Singer, Frank, Dachs, Jurgen, Bachler, Alfred
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Cavities for holding semiconductor chips are etched anisotropically into a semiconductor wafer. An orientation of the wafer in the (100) pulling direction results in geometrically exactly etched sidewalls of the cavities with an angle of 125.3°. What is thereby achieved is that chips can slip into the cavity with a low risk of damage. A transparent cover plate is situated on the cavity plate.