System for different bond pads in an integrated circuit package

System for different bond pads in an integrated circuit package

An integrated circuit package is provided with a substrate having first and second contact pads exposed through a passivation layer on the substrate. A first metallurgy layer is over the substrate. A second metallurgy layer is over the first metallurgy layer. A protective layer is over the first con...

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Bibliographische Detailangaben
Hauptverfasser: Zhao, Lun, Looi, Wan Lay, Aung, Kyaw Oo, Jin, Yonggang, Song, Jae-Yong, Shin, Won Sun
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An integrated circuit package is provided with a substrate having first and second contact pads exposed through a passivation layer on the substrate. A first metallurgy layer is over the substrate. A second metallurgy layer is over the first metallurgy layer. A protective layer is over the first contact pad.