Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting

Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting

A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero.

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Hauptverfasser: Lim, Young-Sam, Lee, Dong-Jun, Kim, Nam-Soo, Moon, Sung-Taek, Kang, Kyoung-Moon, So, Jae-Hyun
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Sprache:eng
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creator Lim, Young-Sam
Lee, Dong-Jun
Kim, Nam-Soo
Moon, Sung-Taek
Kang, Kyoung-Moon
So, Jae-Hyun
description A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero.
format Patent
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title Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting
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