Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting
A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero.
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero. |
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