PIN photodiode structure and fabrication process for reducing dielectric delamination

A PIN photodiode, and a method of manufacturing a PIN photodiode that reduces dielectric delamination and increases device reliability. The process proceeds by forming an first type electrode layer on the substrate; forming an intrinsic layer of the first type electrode layer; forming a second type...

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Bibliographische Detailangaben

Hauptverfasser:	Gao, Xiang, Ceruzzi, Alex, Schwed, Steve, Liu, Linlin, Gottfried, Mark
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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