Semiconductor package having enhanced heat dissipation and method of fabricating the same

A semiconductor package comprising a semiconductor chip and a first heat spreader adhered to the upper surface of the semiconductor chip is provided. The first heat spreader comprises a flat metal plate and a plurality of metal balls adhered to the flat metal plate. A method of fabricating the semic...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Kim, Sang-uk, Im, Yun-hyeok
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A semiconductor package comprising a semiconductor chip and a first heat spreader adhered to the upper surface of the semiconductor chip is provided. The first heat spreader comprises a flat metal plate and a plurality of metal balls adhered to the flat metal plate. A method of fabricating the semiconductor chip package is also provided.