Semiconductor manufacturing apparatus having a built-in inspection apparatus and a device manufacturing method using said manufacturing apparatus

According to the present invention, a chemical and mechanical polishing apparatus for a sample such as a wafer includes a built-in inspection apparatus incorporated therein. The polishing apparatus further comprises a load unit, a chemical and mechanical polishing unit, a cleaning unit, a drying unit and an unload unit. The chemical and mechanical polishing apparatus receives a sample from a preceding step, carries out respective processes for the sample by said respective units disposed within the polishing apparatus and then transfers the processed sample to a subsequent step. Sample loading and unloading means and a sample transfer means are no more necessary for transferring the sample between respective units.