Multi-layer film packaging of hot melt adhesive
Multi-layer films are used to package hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. Multi-layer films wherein at least one layer has a melting point below about 100° C. is used to package low application temperature hot melt adhesives.
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | Multi-layer films are used to package hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. Multi-layer films wherein at least one layer has a melting point below about 100° C. is used to package low application temperature hot melt adhesives. |
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