Methods for the electrochemical deposition of copper onto a barrier layer of a work piece

Methods for the electrochemical deposition of copper onto a barrier layer of a work piece

Methods are provided for electrochemically depositing copper on a work piece. One method includes the step of depositing overlying the work piece a barrier layer having a surface and subjecting the barrier layer surface to a surface treatment adapted to facilitate deposition of copper on the barrier...

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Bibliographische Detailangaben
Hauptverfasser: Kailasam, Sridhar K, Drewery, John, Reid, Jonathan D, Webb, Eric G, Sukamto, Johanes H
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Methods are provided for electrochemically depositing copper on a work piece. One method includes the step of depositing overlying the work piece a barrier layer having a surface and subjecting the barrier layer surface to a surface treatment adapted to facilitate deposition of copper on the barrier layer. Copper then is electrochemically deposited overlying the barrier layer.