Chip board and a process for the preparation thereof

A chip board including an intermediary layer and a layer of large chips positioned on both sides of said intermediary layer. An outer layer is provided on the 5 outer surface of each layer of large chips. In addition to the chips, the layers include an adhesive. The intermediary layer includes a mix...

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Bibliographische Detailangaben

Hauptverfasser:	Isaksson, Jan, Nilsson, Bo
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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