Chip board and a process for the preparation thereof

A chip board including an intermediary layer and a layer of large chips positioned on both sides of said intermediary layer. An outer layer is provided on the 5 outer surface of each layer of large chips. In addition to the chips, the layers include an adhesive. The intermediary layer includes a mixture of wood chips having chip fractions of a chip size of 0.1 to 20 mm, and the chips of this layer are randomly oriented. The individual chip in the layer of large chips presents the following characteristics: a length of approx. 50 to approx. 130 mm, a width of approx. 4 to approx. 40 mm and a thickness of approx. 0.2 to approx. 2.0 mm. The chips within each layer of large chips are all oriented in one and the same direction. As a result, a chip board is obtained which demonstrates a significantly higher E-module and stiffness in flexure than hitherto known despite a reduced consumption of material.