Use of fluorinated additives in the etching or polishing of integrated circuits

Use of fluorinated additives in the etching or polishing of integrated circuits

T′36nCFXOmT23n2Use in etching or polishing of integrated circuits of fluorinated additives of formula (I): (CFO)()   (I) having a number average molecular weight in the range 250-400, in particular of the compound Cl(CF-CF(CF)O)CFCOONa.

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Bibliographische Detailangaben
Hauptverfasser: Visca, Mario, Chittofrati, Alba, D'Aprile, Fiorenza
Format: Patent
Sprache:eng
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Zusammenfassung:T′36nCFXOmT23n2Use in etching or polishing of integrated circuits of fluorinated additives of formula (I): (CFO)()   (I) having a number average molecular weight in the range 250-400, in particular of the compound Cl(CF-CF(CF)O)CFCOONa.