Multi-row lead frame

122 1 A lead frame for a semiconductor device includes a first row of terminals surrounding a die receiving area and a second row of terminals spaced from and surrounding the first row of terminals. The first and second rows of terminals have a first height (H). The terminals of the first row include a step that has a greater height (H). Bond wires connecting die pads to the first row terminals extend over the second height Hpart of the terminal and are attached to the first height Hpart of the terminal. The step insures that the bond wires attached to the stepped terminals have a high wire kink profile so that they are less susceptible to damage in later process steps.