Semiconductor device and method for fabricating the same
A method for fabricating a semiconductor device including forming a depression in a front surface of a semiconductor substrate, forming an electrode pad within the depression, forming structures including circuit devices and metal wires on the front surface of the semiconductor substrate, and exposi...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A method for fabricating a semiconductor device including forming a depression in a front surface of a semiconductor substrate, forming an electrode pad within the depression, forming structures including circuit devices and metal wires on the front surface of the semiconductor substrate, and exposing the electrode pad by removing a rear surface of the semiconductor substrate. |
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