Process for high strength, high conductivity copper alloy of Cu-Ni-Si group

Process for high strength, high conductivity copper alloy of Cu-Ni-Si group

A process for producing a copper-nickel-silicon alloy having a yield strength above 90 ksi with an electrical conductivity above 50% IACS. The process includes melting and continuously casting raw material to obtain an alloy containing 1-3 wt. % nickel, 0.2 to 0.7 wt. % silicon, remainder copper and...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: Kamf, Claes Anders
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Kamf, Claes Anders
description A process for producing a copper-nickel-silicon alloy having a yield strength above 90 ksi with an electrical conductivity above 50% IACS. The process includes melting and continuously casting raw material to obtain an alloy containing 1-3 wt. % nickel, 0.2 to 0.7 wt. % silicon, remainder copper and unavoidable impurities; cold delivering the alloy to form a cold-rolled alloy, solution annealing the cold-rolled alloy; cold rolling the annealed alloy; and precipitation annealing the cold-rolled annealed alloy at a temperature of 450-500 degrees C. for four to ten hours with a cooling rate of 10-20 degrees C. per hour.
format Patent
fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07291232</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07291232</sourcerecordid><originalsourceid>FETCH-uspatents_grants_072912323</originalsourceid><addsrcrecordid>eNrjZPAOKMpPTi0uVkjLL1LIyEzPUCguKUrNSy_J0IFwk_PzUkqTSzLLMksqgZyCgtQihcScnPxKhfw0BedSXb9M3eBMhfSi_NICHgbWtMSc4lReKM3NoODmGuLsoVtaXJBYkppXUhyfXpQIogzMjSwNjYyNjIlQAgDgLDWr</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Process for high strength, high conductivity copper alloy of Cu-Ni-Si group</title><source>USPTO Issued Patents</source><creator>Kamf, Claes Anders</creator><creatorcontrib>Kamf, Claes Anders ; Luvata OY</creatorcontrib><description>A process for producing a copper-nickel-silicon alloy having a yield strength above 90 ksi with an electrical conductivity above 50% IACS. The process includes melting and continuously casting raw material to obtain an alloy containing 1-3 wt. % nickel, 0.2 to 0.7 wt. % silicon, remainder copper and unavoidable impurities; cold delivering the alloy to form a cold-rolled alloy, solution annealing the cold-rolled alloy; cold rolling the annealed alloy; and precipitation annealing the cold-rolled annealed alloy at a temperature of 450-500 degrees C. for four to ten hours with a cooling rate of 10-20 degrees C. per hour.</description><language>eng</language><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7291232$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,802,885,64038</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7291232$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kamf, Claes Anders</creatorcontrib><creatorcontrib>Luvata OY</creatorcontrib><title>Process for high strength, high conductivity copper alloy of Cu-Ni-Si group</title><description>A process for producing a copper-nickel-silicon alloy having a yield strength above 90 ksi with an electrical conductivity above 50% IACS. The process includes melting and continuously casting raw material to obtain an alloy containing 1-3 wt. % nickel, 0.2 to 0.7 wt. % silicon, remainder copper and unavoidable impurities; cold delivering the alloy to form a cold-rolled alloy, solution annealing the cold-rolled alloy; cold rolling the annealed alloy; and precipitation annealing the cold-rolled annealed alloy at a temperature of 450-500 degrees C. for four to ten hours with a cooling rate of 10-20 degrees C. per hour.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZPAOKMpPTi0uVkjLL1LIyEzPUCguKUrNSy_J0IFwk_PzUkqTSzLLMksqgZyCgtQihcScnPxKhfw0BedSXb9M3eBMhfSi_NICHgbWtMSc4lReKM3NoODmGuLsoVtaXJBYkppXUhyfXpQIogzMjSwNjYyNjIlQAgDgLDWr</recordid><startdate>20071106</startdate><enddate>20071106</enddate><creator>Kamf, Claes Anders</creator><scope>EFH</scope></search><sort><creationdate>20071106</creationdate><title>Process for high strength, high conductivity copper alloy of Cu-Ni-Si group</title><author>Kamf, Claes Anders</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_072912323</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Kamf, Claes Anders</creatorcontrib><creatorcontrib>Luvata OY</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kamf, Claes Anders</au><aucorp>Luvata OY</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Process for high strength, high conductivity copper alloy of Cu-Ni-Si group</title><date>2007-11-06</date><risdate>2007</risdate><abstract>A process for producing a copper-nickel-silicon alloy having a yield strength above 90 ksi with an electrical conductivity above 50% IACS. The process includes melting and continuously casting raw material to obtain an alloy containing 1-3 wt. % nickel, 0.2 to 0.7 wt. % silicon, remainder copper and unavoidable impurities; cold delivering the alloy to form a cold-rolled alloy, solution annealing the cold-rolled alloy; cold rolling the annealed alloy; and precipitation annealing the cold-rolled annealed alloy at a temperature of 450-500 degrees C. for four to ten hours with a cooling rate of 10-20 degrees C. per hour.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_uspatents_grants_07291232
source USPTO Issued Patents
title Process for high strength, high conductivity copper alloy of Cu-Ni-Si group
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-09T09%3A04%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Kamf,%20Claes%20Anders&rft.aucorp=Luvata%20OY&rft.date=2007-11-06&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E07291232%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true