Process for high strength, high conductivity copper alloy of Cu-Ni-Si group

A process for producing a copper-nickel-silicon alloy having a yield strength above 90 ksi with an electrical conductivity above 50% IACS. The process includes melting and continuously casting raw material to obtain an alloy containing 1-3 wt. % nickel, 0.2 to 0.7 wt. % silicon, remainder copper and unavoidable impurities; cold delivering the alloy to form a cold-rolled alloy, solution annealing the cold-rolled alloy; cold rolling the annealed alloy; and precipitation annealing the cold-rolled annealed alloy at a temperature of 450-500 degrees C. for four to ten hours with a cooling rate of 10-20 degrees C. per hour.