Stress-free lead frame
The present invention relates to a stress-free lead frame for a semiconductor. The stress-free lead frame is provided with a stress-relief means and an interlocking means at the outer periphery. The stress-relief means is capable of accommodating expansion and compression while the interlocking mean...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The present invention relates to a stress-free lead frame for a semiconductor. The stress-free lead frame is provided with a stress-relief means and an interlocking means at the outer periphery. The stress-relief means is capable of accommodating expansion and compression while the interlocking means take care of shock and vibration during handling to thereby eliminate delamination of the lead frame. |
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