Stacked die-in-die BGA package with die having a recess

Stacked die-in-die BGA package with die having a recess

Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies are provided. In an embodiment of the methods, a second die is mounted on a first die which is at least partially received within a recess of the second die and an overall height of the dies withi...

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Bibliographische Detailangaben
Hauptverfasser: Tan, Hock Chuan, Lim, Thiam Chye, Tan, Victor Cher Khng, Neo, Chee Peng, Tan, Michael Kian Shing, Chew, Beng Chye, Pour, Cheng Poh
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
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Beschreibung
Zusammenfassung:Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies are provided. In an embodiment of the methods, a second die is mounted on a first die which is at least partially received within a recess of the second die and an overall height of the dies within the device is less than a combined height of the dies.