Production method of suspension board with circuit
A production method of a suspension board with circuit that can provide reduced number of man-hour and complicated processes for forming the ground terminal, to provide production cost reduction. An insulating base layer having a base opening portion is formed on a metal board at a ground terminal f...
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| creator | Aonuma, Hidenori Ohwaki, Yasuhito |
| description | A production method of a suspension board with circuit that can provide reduced number of man-hour and complicated processes for forming the ground terminal, to provide production cost reduction. An insulating base layer having a base opening portion is formed on a metal board at a ground terminal forming position, and a thin metal film is formed on the metal board exposed in the base opening portion and on the insulating base layer . Then, a conductive pattern is formed on the thin metal film . Then, an insulating cover layer covering the conductive pattern and having a cover opening portion which correspond in position to the base opening portion is formed on the insulating base layer . Then, a metal board opening portion from which the base opening portion and the insulating base layer around it are exposed is formed in the metal board . Then, an electrolytic plating layer is formed on each side of the conductive pattern exposed in the cover opening portion , feeding electric power from the conductive pattern , and a metal filling layer is formed in the metal board opening portion , to allow the electrolytic plating layer and the metal board to be conductive with each other. |
| format | Patent |
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An insulating base layer having a base opening portion is formed on a metal board at a ground terminal forming position, and a thin metal film is formed on the metal board exposed in the base opening portion and on the insulating base layer . Then, a conductive pattern is formed on the thin metal film . Then, an insulating cover layer covering the conductive pattern and having a cover opening portion which correspond in position to the base opening portion is formed on the insulating base layer . Then, a metal board opening portion from which the base opening portion and the insulating base layer around it are exposed is formed in the metal board . Then, an electrolytic plating layer is formed on each side of the conductive pattern exposed in the cover opening portion , feeding electric power from the conductive pattern , and a metal filling layer is formed in the metal board opening portion , to allow the electrolytic plating layer and the metal board to be conductive with each other.</description><language>eng</language><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7272889$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64012</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7272889$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Aonuma, Hidenori</creatorcontrib><creatorcontrib>Ohwaki, Yasuhito</creatorcontrib><creatorcontrib>Nitto Denko Corporation</creatorcontrib><title>Production method of suspension board with circuit</title><description>A production method of a suspension board with circuit that can provide reduced number of man-hour and complicated processes for forming the ground terminal, to provide production cost reduction. An insulating base layer having a base opening portion is formed on a metal board at a ground terminal forming position, and a thin metal film is formed on the metal board exposed in the base opening portion and on the insulating base layer . Then, a conductive pattern is formed on the thin metal film . Then, an insulating cover layer covering the conductive pattern and having a cover opening portion which correspond in position to the base opening portion is formed on the insulating base layer . Then, a metal board opening portion from which the base opening portion and the insulating base layer around it are exposed is formed in the metal board . Then, an electrolytic plating layer is formed on each side of the conductive pattern exposed in the cover opening portion , feeding electric power from the conductive pattern , and a metal filling layer is formed in the metal board opening portion , to allow the electrolytic plating layer and the metal board to be conductive with each other.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZDAKKMpPKU0uyczPU8hNLcnIT1HIT1MoLi0uSM0rBgkm5ScWpSiUZ5ZkKCRnFiWXZpbwMLCmJeYUp_JCaW4GBTfXEGcPXaCmxJLUvJLi-PSiRBBlYG5kbmRhYWlMhBIAyiEtaA</recordid><startdate>20070925</startdate><enddate>20070925</enddate><creator>Aonuma, Hidenori</creator><creator>Ohwaki, Yasuhito</creator><scope>EFH</scope></search><sort><creationdate>20070925</creationdate><title>Production method of suspension board with circuit</title><author>Aonuma, Hidenori ; Ohwaki, Yasuhito</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_072728893</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Aonuma, Hidenori</creatorcontrib><creatorcontrib>Ohwaki, Yasuhito</creatorcontrib><creatorcontrib>Nitto Denko Corporation</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Aonuma, Hidenori</au><au>Ohwaki, Yasuhito</au><aucorp>Nitto Denko Corporation</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Production method of suspension board with circuit</title><date>2007-09-25</date><risdate>2007</risdate><abstract>A production method of a suspension board with circuit that can provide reduced number of man-hour and complicated processes for forming the ground terminal, to provide production cost reduction. An insulating base layer having a base opening portion is formed on a metal board at a ground terminal forming position, and a thin metal film is formed on the metal board exposed in the base opening portion and on the insulating base layer . Then, a conductive pattern is formed on the thin metal film . Then, an insulating cover layer covering the conductive pattern and having a cover opening portion which correspond in position to the base opening portion is formed on the insulating base layer . Then, a metal board opening portion from which the base opening portion and the insulating base layer around it are exposed is formed in the metal board . Then, an electrolytic plating layer is formed on each side of the conductive pattern exposed in the cover opening portion , feeding electric power from the conductive pattern , and a metal filling layer is formed in the metal board opening portion , to allow the electrolytic plating layer and the metal board to be conductive with each other.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| source | USPTO Issued Patents |
| title | Production method of suspension board with circuit |
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