Production method of suspension board with circuit

A production method of a suspension board with circuit that can provide reduced number of man-hour and complicated processes for forming the ground terminal, to provide production cost reduction. An insulating base layer having a base opening portion is formed on a metal board at a ground terminal forming position, and a thin metal film is formed on the metal board exposed in the base opening portion and on the insulating base layer . Then, a conductive pattern is formed on the thin metal film . Then, an insulating cover layer covering the conductive pattern and having a cover opening portion which correspond in position to the base opening portion is formed on the insulating base layer . Then, a metal board opening portion from which the base opening portion and the insulating base layer around it are exposed is formed in the metal board . Then, an electrolytic plating layer is formed on each side of the conductive pattern exposed in the cover opening portion , feeding electric power from the conductive pattern , and a metal filling layer is formed in the metal board opening portion , to allow the electrolytic plating layer and the metal board to be conductive with each other.