Multi-heatsink integrated cooling device

A multi-heatsink integrated cooling device comprises a crossflow cooler and a primary heatsink thermally connected by heat-spreading means. The crossflow cooler comprises a casing with an inlet and an outlet, and a radial impeller and heat-exchanging means located inside of the casing. The casing comprises side parts, a cover and a lower plates contacted with the heat-exchanging means and first of the electronic components. The primary heatsink comprises housing and heat-exchanging members located inside of the housing. The housing comprises a base, sidewalls and a cover, thus forming inflow and outflow openings. The base contacted with the heat-exchanging members and second of the electronic components. The primary heatsink and the crossflow cooler located in such a way that the outflow opening is adjacent to the inlet, thus cooling air flows through the primary heatsink, the inlet, the heat-exchanging means, the radial impeller and the outlet in a series way.