Substrate based IC-package

A semiconductor component comprises a substrate that includes wiring on a first surface. A chip is mounted on a second surface of the substrate by a die attach, the second surface opposite the first surface. A bond channel in the center of the substrate allows for electrical connection of contact pads on the wiring with bond pads arranged in a center row on the chip by wire loops. A housing made of a mold compound surrounds a backside of the chip and parts of the substrate adjacent to the wiring. The semiconductor component further comprises a rigid prepreg layer covering, as well as the wiring of the substrate and the prepreg layer being provided with openings. Each opening is arranged in such a manner that the contact pads are accessible, and solder balls are mounted on each of the contact pads through the openings.