Hermetic cavity package
A packaging structure is provided having a hermetic sealed cavity for microelectronic applications. The packaging structure comprises first and second packaging layers forming a cavity. Two liquid crystal polymer (LCP) layers are formed between and hermetically seal the first and second packaging la...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A packaging structure is provided having a hermetic sealed cavity for microelectronic applications. The packaging structure comprises first and second packaging layers forming a cavity. Two liquid crystal polymer (LCP) layers are formed between and hermetically seal the first and second packaging layers. First and second conductive strips are formed between the LCP layers and extend into the cavity. An electronic device is positioned within the cavity and is coupled to the first and second conductive strips. |
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