Method and apparatus for high-resolution defect location and classification

In the manufacture of integrated circuits on a wafer, it is necessary to monitor the manufacturing process by inspecting the ICs as to whether errors or defects have occurred during production. It is already known to use a scattered-light device to determine whether a defect is present on the wafer. According to the present invention, defect examination is now improved in that defect-suspected regions are identified using the scattered-light device. With a further examination system different from the scattered-light device, a determination is then made as to whether the defect-suspected regions are defects. The latter can then also be classified.