Semiconductor device using LED chip
A semiconductor device includes an insulating substrate having an obverse surface formed with a die pad , a rectangular semiconductor chip such as an LED chip bonded to the die pad with a die bonding material , and a molded portion made of a synthetic resin for packaging the semiconductor chip. The...
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| Zusammenfassung: | A semiconductor device includes an insulating substrate having an obverse surface formed with a die pad , a rectangular semiconductor chip such as an LED chip bonded to the die pad with a die bonding material , and a molded portion made of a synthetic resin for packaging the semiconductor chip. The die pad may be rectangular with dimensions close to those of the semiconductor chip or circular with a diameter close to the diagonal dimension of the semiconductor chip, whereby the positioning and orienting of the semiconductor chip can be accurately performed in bonding the semiconductor chip. |
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