Peelable circuit board foil

In one embodiment, a peelable circuit board foil has a metal support layer and a conductive metal foil layer bonded by an inorganic high temperature release structure that comprises a co-deposited layer and a metal oxide layer. The co-deposited layer comprises an admixture of nickel and one or more of boron, phosphorus, and chromium. In a second embodiment, the peelable printed circuit foil has a crystallized dielectric oxide layer disposed on the metal foil layer and an electrode layer disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.