Light emitting diode component
A light emitting package includes a printed circuit board supporting at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter connected with the printed circuit board. An inside surface of t...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A light emitting package includes a printed circuit board supporting at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume containing the at least one light emitting die. An encapsulant is disposed in the interior volume and covers at least the light emitting die. |
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