Structure with heat dissipating device and method

A structure comprises a thermal energy generating component and a thermal dissipating device in thermal conductive contact with the component, the device comprising a substrate with a fullerene coating. A method of producing a computer comprises applying a layer of fullerene onto a substrate and dis...

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Bibliographische Detailangaben
1. Verfasser: Freedman, Philip D
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A structure comprises a thermal energy generating component and a thermal dissipating device in thermal conductive contact with the component, the device comprising a substrate with a fullerene coating. A method of producing a computer comprises applying a layer of fullerene onto a substrate and disposing the substrate in a heat dissipation relationship to a microprocessor.