Creating a power distribution arrangement with tapered metal wires for a physical design

Methods of creating a power distribution arrangement with tapered metal wires for a physical design are provided and described. In one embodiment, a method of creating a power distribution arrangement for a physical design of an integrated circuit includes arranging a plurality of metal wires for power distribution in a desired arrangement. Each metal wire has a width. Furthermore, the metal wires are tapered such that the width is thicker in a core edge area of the physical design than in a core center area of the physical design. In other embodiments, a method of creating a power distribution arrangement for a physical design of a current integrated circuit includes arranging a plurality of metal wires for power distribution in a desired arrangement. The metal wires are tapered using a routing congestion profile and/or a voltage drop profile of a prior physical design of a prior integrated circuit.