Apparatus and method for scribing a semiconductor wafer while controlling scribing forces
A system for controlling scribing forces when scribing a semiconductor wafer includes supporting a scribe tool on an air bearing shaft. An encoder reads an encoder scale attached to the air bearing shaft and transport structure moves the tool support structure up or down to control the scribing forc...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A system for controlling scribing forces when scribing a semiconductor wafer includes supporting a scribe tool on an air bearing shaft. An encoder reads an encoder scale attached to the air bearing shaft and transport structure moves the tool support structure up or down to control the scribing force responsive to signals from the encoder. |
---|