Apparatus and method for scribing a semiconductor wafer while controlling scribing forces

A system for controlling scribing forces when scribing a semiconductor wafer includes supporting a scribe tool on an air bearing shaft. An encoder reads an encoder scale attached to the air bearing shaft and transport structure moves the tool support structure up or down to control the scribing forc...

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Bibliographische Detailangaben
Hauptverfasser: Lindsey, Jr, Paul C, Engel, Bradley B
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A system for controlling scribing forces when scribing a semiconductor wafer includes supporting a scribe tool on an air bearing shaft. An encoder reads an encoder scale attached to the air bearing shaft and transport structure moves the tool support structure up or down to control the scribing force responsive to signals from the encoder.