Double action punch assembly for hydroforming die

A double action punch assembly for a hydroforming die includes a first punch segment having an aperture extending therethrough. The double action punch assembly also includes a movable mounting block disposed in the aperture of the first punch segment. The double action punch assembly further includes a plurality of second punch segments connected to the mounting block. The first punch segment is moved in a first action to pierce a tubular member in a first direction and the second punch segments are moved in a second action to pierce the tubular member in a second direction to produce an opening in the tubular member.