Thermal mounting plate for heated pressure transducer

A transducer assembly including a sensor housing, a heater shell located in the sensor housing, a heater operatively coupled to the heater shell, a sensor received in the heater shell, and an electronics assembly positioned within the sensor housing, outside of the heater shell, and adapted to receive signals from the sensor. The assembly also includes a mounting plate positioned within the sensor housing, outside of the heater shell. The mounting plate has arms extending therefrom and at least one attachment point where the electronics assembly is secured to the mounting plate. The arms are secured to the sensor housing, and the mounting plate includes apertures adjacent to the arms for impeding thermal conduction between the arms and the attachment point.