Electrically conducting bonding connection
An electrically conducting bonding connection (B) is produced between an electronic circuit (S) arranged on an electrically conducting support plate and the support plate by providing a hole, into which an electrically conducting bonding element with a bondable surface is pressed in such a way that...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | An electrically conducting bonding connection (B) is produced between an electronic circuit (S) arranged on an electrically conducting support plate and the support plate by providing a hole, into which an electrically conducting bonding element with a bondable surface is pressed in such a way that the support plate and the bonding element enter into an electrically conducting and frictional connection; the bonding connection is subsequently produced with the bonding element. |
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