Land grid array with socket plate

A grounded conductive plate in a land grid array package assembly includes a plurality of openings. The openings allow contacts from the socket to pass through to contact a package. The diameter of each opening is customizable to produce desired impedance between the contacts and the conductive plat...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Stone, Brent S, Auernheimer, Joel A
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A grounded conductive plate in a land grid array package assembly includes a plurality of openings. The openings allow contacts from the socket to pass through to contact a package. The diameter of each opening is customizable to produce desired impedance between the contacts and the conductive plate. Impedance discontinuity seen by signals passing through the socket may be reduced.