Method for cooling electronic components and thermally conductive sheet for use therewith

A thermally conductive sheet includes a thermally conductive layer and an insulation layer laminated onto the thermally conductive layer. The thermally conductive layer includes matrix containing thermally conductive filler having an electrical conductivity. The insulation layer contains thermally conductive filler having an insulating property. The thermally conductive sheet is disposed so that the insulation layer covers the terminal of the electronic component and the electric circuit. At this time, the thermally conductive layer covers and closely contacts with the insulation layer and the electronic component. The heat generated by the electronic component is conducted to a cooling member through the thermally conductive layer and is ultimately dissipated.