Multiple-ball wire bonds
The invention provides a wire bond comprising multiple ball bonds and a method of forming the wire bond to bond a wire to a connection pad of an electronic device. The wire bond comprises a first bump ball formed on the connection pad and a second bump ball formed on the connection pad that is conti...
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| Hauptverfasser: | , |
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| Format: | Patent |
| Sprache: | eng |
| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | The invention provides a wire bond comprising multiple ball bonds and a method of forming the wire bond to bond a wire to a connection pad of an electronic device. The wire bond comprises a first bump ball formed on the connection pad and a second bump ball formed on the connection pad that is contiguous with the first bump ball. |
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