Lead frame with flag support structure
A lead frame for a packaged electronic device having split flag structures coupled by support structures. The support structures include bend portions for providing stress relief between the flag structures during the manufacture and/or during the operation of a packaged electronic device. In one em...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A lead frame for a packaged electronic device having split flag structures coupled by support structures. The support structures include bend portions for providing stress relief between the flag structures during the manufacture and/or during the operation of a packaged electronic device. In one embodiment, the packaged electronic device includes an inertial sensor. |
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