Integrated circuit and method of manufacturing an integrated circuit and package

A packaged IC includes an IC die with signal and signal complement traces positioned relative to each other to maximize broadside coupling for a matching impedance. The signal and signal complement traces are electrically connected to transmission or receive channels of the IC die. Use of a broadsid...

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Bibliographische Detailangaben
Hauptverfasser: Devnani, Nurwati S, Barnes, James Oliver, Moore, Charles E, Lai, Benny W H
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A packaged IC includes an IC die with signal and signal complement traces positioned relative to each other to maximize broadside coupling for a matching impedance. The signal and signal complement traces are electrically connected to transmission or receive channels of the IC die. Use of a broadside coupled trace configuration alleviates routing congestion in an IC package and permits an IC to accommodate a greater number of channels within a given surface area than is possible under the prior art.