Cavity down no lead package

An IC package includes a leadframe disposed within a mold body. A paddle is situated substantially on a first mold body surface. An outer paddle surface is substantially exposed for dissipating heat. A semiconductor die is coupled onto an inner paddle surface. A first portion of leads is formed against a side surface of the mold body for coupling to a PCB placed against a second mold body surface opposite to the first mold body surface. The footprint of the IC package is substantially coextensive with the footprint of the mold body. In another embodiment, an IC package includes a heat spreader having a semiconductor die attach area on an inner heat spreader surface between a first heat spreader end and a second heat spreader end. The heat spreader has insulator elements coupled to the ends of the heat spreader. The insulator elements can have bonding areas thereon.